Manual Bonders – 7KE Series
UNLIMITED PART SIZE: Access to remote bond targets on large
packages or modules with WEST·BOND’s throat-less chassis and
micromanipulator design. All machines components are arrayed above the
horizontal bond plane, eliminating any restriction to package size or shape.
With the EX version of this system, the bonder can be suspended over very
large parts. This manual model can be configured to bond all types of
applications from ● Microwave ● Semiconductor to ● RF and ● Hybrid
CONVERTABILITY: WEST·BOND introduced the first triple convertible wire
bonder back in November of 1969, today WEST·BOND introduces a new tool head
that can bond it all: 45º wedge, 90º feed for wire and ribbon as well as ball bonding. A
simple exchange of clamp assemblies, bond tool, and wire path provided with the
software mode will allow conventional 45º wire feed, deep access wire or ribbon, ball
bonding, insulated wire and single point tab / lead bonding. All programmed bond
variables as well as machine settings for each bond mode are retained in the machines
Semi-Automatic Bonders – 4KE Series
AUTOMATIC PRECISION at a fraction of the cost. Microprocessor controlled motor drives for both Y and Z-axes bond a succession of parallel, single or multiple arched wires maintaining identical loop and bond shapes. Unlimited deep-reach access to bond targets on IC packages of any X-Y dimension with West•Bond’s throatless chassis and micromanipulator designs. Ideal for bonding high power, high frequency devices where identical bond and loop shapes are critical.
CONVERTIBILITY for angled and vertical wire feed wedge bonding is easily accomplished with a simple change of clamping mechanisms, both of which are included with Model 4546E. Model 4546E expands convertibility with a 45° tool head and 90° tool head. All program variables and bond settings for each configuration are retained in memory between conversions.
Automatic Wire Bonders
UNPARALLELED PERFORMANCE in ultrasonic, thermo-sonic and thermo-compression fine wire, ribbon, and ball bonding. Unique design features qualify the 353637F Series for the most demanding microwave, semiconductor, R.F., and hybrid production where precision and repeatability are critical. With compact dimensions (52“h x 30”w x 28”d), rugged construction, a reputation for dependability and ease of maintenance, the West·Bond 353637F Series is the most versatile automatic wire bonder available today. The mechanism of this series was designed to mount above a customer’s work handling system, to be confined entirely above the work plane, and so not to require any base or work platform: Custom mounting brackets can be designed to join to customer’s mechanism.
Manual Die Bonders
7372E · 7367E · 7374E Series
The significant advantages of the E-Series – gantry construction to allow unlimited work piece size, orthogonal motions rather than pivoted, individual axis brakes – are brought to West·Bond’s line of Dual-Head Die Bonders by this completely new design. All of the B-Series models were included in the change-over, and all of their features preserved in their E-Series replacements. ESD protection is included as an added bonus.
Dual-Head Die Bonders use the heads alternately to pick up chips; then rotate, place, and bond them. Both pick-up and bonding can be done by different methods, changeable by detachable heads. The machine action to exchange heads
places each one in view at the same use position, and by
motions that are now also orthogonal rather than pivoted.
Embodied in this series is a new three-axis micromanipulator which allows all the machine mechanism to be arrayed above the work plane, so that there is now no limit to the size of a work piece. Each of the X, Y, and Z axes is straight-line and purely orthogonal, and each can be braked pneumatically on signal. Dual counterweights balance the pantograph arm and the tool support individually. The standard manipulator control arm locates the control point at table elevation; an alternate control arm and wrist-rest are available for use with very large work pieces to move the control point above the work plane.
Wire Bond Pull Testers
UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal work area, eliminating any restrictions to package size or shape. Manual “E” Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.